Epoxid Bonding Fins

Bonding between bottom plate and fins is done by using a special glue. The special glue is curing at room temperature and so prevents possible material distortion. In contrast to other manufacturing procedures a very small spacing between the fins can be implemented by gluing to allow improved heat dissipation.

Your advantages

• More favorable alternative to soldering

• Higher fin density allows improved heat dissipation

• No material distortion

• Lower quantities feasible