Epoxid Bonding Fins
Bonding between bottom plate and fins is done by using a special glue. The special glue is curing at room temperature and so prevents possible material distortion. In contrast to other manufacturing procedures a very small spacing between the fins can be implemented by gluing to allow improved heat dissipation.
- More favorable alternative to soldering
- Higher fin density allows improved heat dissipation
- No material distortion
- Lower quantities feasible